Micro-vias can be easily integrated into your design using functionality within the Layer Spans option. Create intelligent Micro-vias, laser-drilled from the top or bottom sides and differentiated from other non-lasered vias. Micro-via types for normal, tapered, stacked, composite and stacked/tapered can be created to suit your manufacturing processes and requirements. Where Micro-vias require a Stop pad for laser-drilling, this can style can also be defined, as well as a Start pad definition. Composite Micro-vias can be created for multi-spanned vias; these would be separate vias moving as one 'unit' in the design for maximum design integrity.