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PULSONIX Advanced Features 

Pulsonix Advanced Technology

The Advanced Technology option contains support for:-

  • Micro-vias
  • Flexi-rigid boards
  • Embedded components: resistors, capacitors and planar transformers
  • Internally embedded components within cavities: semiconductors and thinned dies
  • Chip-On-Board designs containing bare dies
  • Layer spanned Vias, Areas, Board Outline Cutouts and Components


The Pulsonix development team were very involved in implementing Thinned Die technology into Pulsonix. They were heavily involved in the European funded project, HERMES, with a very successful positive outcome for the Pulsonix product.

Micro Vias

 

Micro Vias

Micro Vias 3D View

Micro-vias can be easily integrated into your design using functionality within the Layer Spans option. Create intelligent Micro-vias, laser-drilled from the top or bottom sides and differentiated from other non-lasered vias. Micro-via types for normal, tapered, stacked, composite and stacked/tapered can be created to suit your manufacturing processes and requirements. Where Micro-vias require a Stop pad for laser-drilling, this can style can also be defined, as well as a Start pad definition. Composite Micro-vias can be created for multi-spanned vias; these would be separate vias moving as one 'unit' in the design for maximum design integrity.

 

Flexi-rigid Designs

 

 

Flexi-rigid Designs

Flexi-Rigid Design

True Flexi-rigid support is available using the features within the Advanced Technology package; Multi-spanned layer Areas, Board Outlines and Layer Spanned Components. Using these powerful options, the Board outline can be created to span 'internal' flexi layers that are still exposed externally. Adding Components to this layer span then allows them to also be exposed to the 'air'. Both through-hole and surface-mounted components on inner flexi layers can be achieved but with true 'side' and layer characteristics available within their Property definitions. This means true assembly reports, manufacturing plots and build details can be exported for an accurate manufacturing process.

 

 

Embedded Components


Embedded Component Technology (ECT)

Embedded Components

Embedded components are becoming more and more common as the need for smaller more dense designs is required. The Pulsonix Advanced Technology option enabled truly embedded components to be properly defined and placed within the board structure, either on an inner surface or internally embedded within the board substrate layer sitting inside a cavity. Using the embedded option, components such as buried and printed resistors, build-up and buried capacitors, planar convertors and transformers can also be easily accommodated such is the flexibility of the Pulsonix interface.

 

Chip-On-Board Design

Chip on Board

True chip-on-board design requires accurate die and bond pad placement, true connectivity between these pads, accurate shape definition and a host of placement, checking and manufacturing requirements; Pulsonix gives you this within the Advanced Technology option. Where die pad positions differ from that of the bond pads, interactive features allow this to be easily achieved. Likewise, once the bond pads have been accurately positioned, the die pads as a die unit can be repositioned. Bond pads are individually placed and constraint rules governing the length and position of the bond wires checked on-the-fly ensuring accuracy at all times.

Layer Spanned Vias, Areas, Board Outlines, Board Outline Cutouts and Components

Layer Spans

Using the advanced features within the Layer Span option, spanned layer definitions can be created to accommodate your designs. Where Areas or Board Outline Cutouts require multi-spanned layers, for cavities within the board or to create a 'void' from the top layer to an internal layer for example, these can easily be added. Using the same mechanism, components which are required to span internal layers for embedded dies or on flexi-rigid layers can also be accurately placed.


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